System and hardware design flow capacity levels must scale quickly to accommodate the data explosion from smaller process nodes, multi-physics analysis across multi-fabric designs, and the need to test systems across operating conditions.
Advanced computational software has successfully responded to hardware design’s intense capacity and performance demands via highly distributed compute methods that efficiently leverage on-premise and cloud compute servers.
However, system design tools had lagged, such as for the 3D solvers used to create highly accurate models for the signal, power, electromagnetic, and thermal integrity analysis performed while designing critical interconnects for PCBs, packaging, and 2.5/3D ICs.
These 3D solvers utilize sophisticated computational software elements, such as finite element analysis, adaptive meshing, matrix solving, and computational fluid dynamics. Unfortunately, their capacity/performance limitations created project slowdowns. Additionally, many designers were forced to hand partition large structures into smaller pieces to analyze in a reasonable time – creating accuracy risks in cases where the partitions were signal transmission weak points.